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Samsung antar YMTC -patent för att hantera flashminnesstaplingsutmaningar
Tid: 2025/02/27
Bläddra: 488
Samsung har nyligen tecknat ett 3D NAND Hybrid Bonding Patent Licensing Agreement med Yangtze Memory Technologies Co. (YMTC).Från sin 10: e generationens V-NAND (V10) kommer Samsung att använda YMTC: s patenterade teknik, särskilt inom området hybridbindning.
Samsung planerar att massproducera nästa generations V10 NAND under andra halvan av 2025, med ett förväntat stackskiktsantal som når 420 till 430 lager.När det överstiger 400 lager kan det ökade trycket på de underliggande perifera kretsarna påverka chip -tillförlitligheten avsevärt.
För att ta itu med denna fråga har Samsung beslutat att integrera skivor-till-wafer (W2W) hybridbindningsteknologi i sin V10 NAND.Denna metod binds direkt två skivor tillsammans utan att förlita sig på traditionella stötförbindelser, effektivt förkorta elektriska vägar, förbättra prestanda och värmeavledning och förbättra tillverkningseffektiviteten.
YMTC var banbrytande för hybridbindningsteknik i 3D NAND tillverkning för fyra år sedan och namngav det XTACKING.Företaget har också inrättat en omfattande patentportfölj inom detta område.
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